www.ieiworld.com www.ieiworld.com WAFER WAFER- -9371A 9371A 3.5” ULV Intel® Celeron® SBC with Onboard CPU, Audio, VGA/LCD and LAN R Ro oH HS S ready ready Cool, Quiet and LCD Support Has Never Been Easier !! Cool, Quiet and LCD Support Has Never Been Easier !! Power IDE +12V GND GND +5V USB ATX Connector Parallel port connector VGA KB/Mouse TFT LCD( One channel) LAN LCD Connector Audio COM Ports LCD Connector TFT LCD CF II LVDS Inverter Control IR ATX Power PC/104 Interface Button -5V, -12V Power/ HDD SO-DIMM Power LED CPU Fan Features Cool and Quiet . On board ULV Intel® Celeron® 400 / 650MHz processor with heatsink. Complete and Easy LCD Support . 36 bit TFT, 18-bit or 24-bit LCD panel, with up to 1024 x 768 resolution supported . 2 channel LVDS interface supported Diskless Booting . IEI BIOS PXE feature supports boot-on-LAN with ATX power supply Green Product . RoHS Compliance JY eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com RoHS ready now ! RoHS ready now ! 28% Power Saving ! 28% Power Saving ! RoHS RoHS Low Low Power Power IEI A Brand Product WAFER-9371A 9371 Form factor 3.5" SBC 3.5" SBC CPU ULV Intel Celeron 400 ULV Intel Celeron 400 NB VT8606T VT8606T SB VT82C686B VT82C686B CRT CRT 36-bit TTL 36-bit TTL Display 2x18 bit LVDS 2x18 bit LVDS 1x EIDE 1x EIDE 1x FDD(optinal) 1x FDD(optinal) 1x K/B 1x K/B 1x M/S 1x M/S 1x RS-232/422/485 1x RS-232/422/485 1x RS232 1x RS232 I/O Interface 1x LPT 1x LPT No RoHS avaliable Now Ethernet 10/100Mbps RTL8100C 10/100Mbps RTL8100BL US B 2x USB 1.1 2x USB 1.1 Audio ALC655 5.1CH ALC202A 2.1CH IrDA 115kbps 115kbps WDT 1~255 sec 1~62 sec Power Consuption 5V@2.01A ULV Celeron 400/256MB 5V@2.79A ULV Celeron 400/256MB Dimention 5.7"x 4" 5.7"x 4" IEI can promise y IEI can promise you longer produ ou longer product life by ct life by components guarantee components guarantee an and d RoHS compliance now ! RoHS compliance now ! eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Power Consumption Power Consumption Real-Time Running Test Real-Time Running Test The testing result is 28% better than A-Brand’s declaration. Testing Steps WAFER-9371A Power Consumption ： (+5V) 10minutes in 25 ℃ Test Sample Unit 2.02 A Ampere Test Configuration CPU Type Celeron(R) 400MHz RAM Module Transcend PC133 256M Install OS: Windows 2000 3D Mark 2001 VGA Type S3-VIA Twister™ T DirectX 9.0b Resolution 800 X 600 Color Pixel 32 VGA Memory 8M Score 365 eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Thermal Testing ! Thermal Testing ! Infrared thermography is a latest development equipment, which detects infrared energy emitted from object, converts it to temperature, and displays image of temperature distribution. Brand NIPPON Model Neo Thermo TVS-700 Testing Result ! Testing Result ! A A- -B Br rand 9371 and 9371 IEI WAFER-9371A IEI WAFER-9371A Area 2 Area 2 Heatsink Heatsink Area Area Area1 Area1 Peak Value Thermal Test Max. Temp Min. Temp Fact 1 Fact 1 WAFER WAFER- -9371A temp range : 14.2 9371A temp range : 14.2 ℃ ℃ 66.7 52.5 WAFER-9371A ℃ ℃ 9371 temp range : 19.5 9371 temp range : 19.5 ℃ ℃ 9371 76.8℃ 57.3℃ WAFER-9371A 80 9371 70 60 IE IEI W I WA AFE FER R- -9371A o 9371A op perates w erates wiith th 50 minimum difference in surface minimum difference in surface 40 temperatures on sep temperatures on separate sectio arate sections ns of the board. A better temperature of the board. A better temperature 30 control guarantees a more reliable control guarantees a more reliable 20 s sy ys ste tem m ope oper ra ation in the tion in the long run. long run. 10 0 Max. Temp Min. Temp eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Heatsink Area Thermal Test Heatsink Fact 2 Fact 2 CPU Temp NB Temp SB Temp Average Temp WAFER-9371A 56.4℃ 56.3℃ 55.5℃ 56.06℃ 9371 57.4℃ 57.3℃ 56.3℃ 57.0℃ CPU Temp 57.5 NB Temp SB Temp 57 Heatsink Average Temp 56.5 56 55.5 55 54.5 WAFER-9371A 9371 Based on the same CPU, NB, and SB components, the WAFER-9371A presents the Based on the same CPU, NB, and SB components, the WAFER-9371A presents the be bette tter the r ther rma mal t l tr ra an ns sf fe er through the r through the he hea at ts siink nk, the , there ref fore ore i is s ide idea all for fanles for fanless s app applications. lications. Board Area 1 and 2 Fact 3 Fact 3 Area 1 Area 2 Thermal Test P4 P6 P7 P8 P5 P9 WAFER-9371A 66.7℃ 52.5℃ 56.8℃ NA 60.0℃ 58.9℃ 9371 75.3℃ 57.4℃ 58.3℃ 60.4℃ 76.8℃ 64.1℃ WAFER-9371A WAFER-9371A 80 9371 80 9371 70 70 60 60 50 50 40 40 30 30 20 20 10 10 0 0 P5 P9 P4 P6 P7 Proven by Proven by the numbers deducted fr the numbers deducted fro om m t th he same ar e same area co ea com mp par ariso ison n i in n multiple hot multiple hot spots, the WAF spots, the WAFE ER R- -9371A is thermally 9371A is thermally su sup pe erior and rior and more apt for embedd more apt for embedded sy ed systems. stems. eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Fact 4 Fact 4 IEI WAFER-9371A IEI WAFER-9371A Area 2 Heatsink Area Area1 A A- -B Br rand 9371 and 9371 Area 2 Heatsink Area Area1 A new heatsink tops three major heat-emitting chips and effectively A new heatsink tops three major heat-emitting chips and effectively dissipates heat. Helped by a new layout, once again the WAFER-9371A dissipates heat. Helped by a new layout, once again the WAFER-9371A is proved to b is proved to be e a coo a cooller choice. er choice. eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Cool and Quiet Cool and Quiet All New Heat-Sink design All New Heat-Sink design I. Good aerodynamics The IEI Heatsink was designed in a way that air can easily and quickly float through the cooler, and reach all cooling fins. Especially it having a very large amount of fine fins. II. Perfect flatness of the contact area by IEI new close flatness technology !!! The part of the heatsink that is in contact with the heat source must be perfectly flat. A flat contact area allows you to use a thinner layer of thermal compound, which will reduce the thermal resistance between heatsink and heat source. III. Good mounting method For good thermal transfer, the pressure between heatsink and heat source must be high. IEI Heatsink clips was designed to provide a strong pressure, while still being reasonably easy to install. IV. Good thermal transfer within the heatsink Large cooling fins are pointless if the heat can't reach them, so the IEI heatsink was designed to allow good thermal transfer from the heat source to the fins. JY eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Complete and Easy LCD Support Complete and Easy LCD Support . One 36 bit TFT, 18-bit or 24-bit LCD panel, with up to 1024 x 768 resolution supported . 2 channel LVDS interface supported Supports a 36-bit LCD panel which must be connected to both the Flat1 (40-pin) and the Flat2 (20-pin). The Flat1 40-pin connector which can support a 24-bit LCD panel With the VIA Twister chip that supports Dual channel (2 x 18 bit) LVDS LCD panel displays. Connect to either an 18-bit or 36-bit LVDS LCD. eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Diskless Booting Diskless Booting . IEI BIOS PXE feature supports Boot-on-LAN with ATX power supply ATM 3 ATM 4 ATM 2 Wafer-9371A Wafer-9371A Wafer-9371A ATM 1 Networking ATM 5 Remote booting all ATM Wafer-9371A systems by central control server to save time and Wafer-9371A man power cost ! Central Remote Server Man Power Saving without booting up system one by one to lower down the total cost !! PXE: Pre-Boot Execution Environment PXE is an open industry standard developed by a number of software and hardware vendors. IEI BIOS PXE Feature allows a workstation to boot from a server on a network prior to booting the operating system on the local hard drive. In order to boot on LAN, it requires setting up the PXE server, too. eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com RoHS Compliance RoHS Compliance IEI is committed to compliance with all applicable laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) in electrical and electronic products. IEI’s goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis IEI use the most Hi-End equipment to achieve RoHS requirement! SPECTRO XEPOS SPECTRO XEPOS Millitary Level Bench top X-Ray Fluorescence Spectrometer Companied by the incoming material, especially for Cr, PBB, PBDE. Function Block Function Block eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Performance Test Performance Test System Configuration ： BIOS ：WAFER-9371A V 1.0 Memory ：512MB SO-DIMM X 1 VGA Card ：VIA 8606 (Onboard VGA) Resolution 1024x768 ,32 bit Color HDD ：Maxtor-80GB YAR410BW0 DVD-ROM ：LITE-ON 16X DVD-ROM SOHC-5232K O.S : Windows 2000 / SP4 Software Celeron-400MHZ Business Winstone 2001 V1.02 19.1 C.C Winstone 2001 V1.0 27.3 CPU Mark(™)99 Version 1.0 Score 38.6 Winbench 99 Business Graphic Winmark 108 Winbench 99 High-End Graphic Winmark 270 3D Mark® 2001 SE Build 330 348 PCMARK 2002 PRO CPU Score 1237 Memory Score 818 HDD Score 733 Read Speed: 23.1MB/s HD Tech V2.70 - Read Speed CPU utilization: 8.6% Compatible Test Compatible Test Test Description Test Result (Pass/Fail) Remark 1) MS-DOS 6.22 Pass 2) MS-Windows 98SE Pass 3) MS-Windows ME Pass 4) MS-Windows NT Server V4.0 Pass 5) MS-Windows NT Workstation V4.0 Pass 6) MS-Windows 2000 Professional Pass 7) MS-Windows 2000 Server Pass *1 No driver support, 8) MS-Windows XP (Home Edition / Professional) Pass only for install 9) QNX RTP 6.2.1 *1 10) NetWare 5.0 Pass 11) SCO Open Server 5.0.6 *1 12) OPEN UNIX 8.0 *1 13) Linux-Fedora Core 3 / SuSE 9.0 / Mandrake 9.2 Pass 14) Win CENET 5.0 Pass 15) Win XPE Pass eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Performance Test Performance Test WAFER-9371A SISoft Sandra Standard Function Item Score Dhrystone ALU 1309 MIPS 1.CPU Whetstone FPU/SSE 541 MFLOPS Integer X 4 iSSE 3511 IT/s 2.CPU-Media Floating-Point X 4 iSSE 4150 IT/s Hard Disk (C:) Drive 29 MB/s Index 3. Drives Hard Disk (D:) Drive Index 4. CD-ROM /DVD Drive Index Int ALU /RAM 458 MB/s Bandwidth 5. Memory Float FPU /RAM 448 MB/s Bandwidth Dimension Dimension eSolution Innovator eSolution Innovator www.ieiworld.com www.ieiworld.com Specification CPU LCD Interface Display Controller ULV Intel® Celeron® 400MHz VIA VT8606 Twister chip with Integrated S3 Savage4, support ULV Intel® Celeron® 650MHz CRT and LVDS display. System Chipset Memory Buffer VIA VT8606 + VIA VT82C686B 8/16/32 MB frame buffer shared with system memory Resolution CRT : 1280 x 1024 @ 60Hz ; 1024 x 768 @ 85Hz DRAM LCD : 1280 x 1024 @ 60Hz ; 1024 x 768 @ 60Hz 144-pin PC100/133 SO-DIMM SDRAM up to 512MByte LCD Interface 4XAGP VGA/LCD interface. Support 18, 24, 36bit TFT 2nd Cache Memory LVDS Interface 256 KB for Celeron® / 512 KB for Pentium® III Dual Channel (2 x 18-bit) LVDS interface Graphic Controller Audio VIA VT8606 Twister chip with Integrated S3 Savage4, support AC'97 Codec ALC655 5.1CH CRT and LVDS display. Watchdog Timer Dimension 1-255 sec ICP6629; 145 mm x 102 mm (5.7” x 4”) Ethernet Power Chipset : Realtek 8100C +5 V only ± 5%, +12 V ± 5% (for PC/104, LCD) Speed : 10/100 Mbps Power Consumption Standard : Supports Full Duplex Flow Control (IEEE 802.3x) 5V 2.01A (Celeron® 400MHz with PC100/133 256MB RAM) I/O Interface Temperature IDE : 1 x Enhanced IDE , 1 x CFA (II) operation: 0 ~ 60° C (32 ~ 140° F) Optional Floppy :1x26 connector Mouse & Keyboard : 1 x PS/2 Keyboard and PS/2 Mouse Humidity Serial Port : 1 x RS232 with D-SUB connector , 1xRS232/422/485 Operation: 0% ~ 90% Relative Humidity pin header Parallel Port : 1 share with Floppy USB: 2 X USB 1.1 Ordering Information Part No. Description ULV Intel® Celeron® 3.5” SBC w/400 MHz CPU, VGA/LCD, LVDS, Ethernet, Audio WAFER-9371A-R10 ULV Intel® Celeron® 3.5” SBC w/650 MHz CPU, VGA/LCD, LVDS, Ethernet, Audio WAFER-9371A-650-R10 WAFER-9371A-CENET5.0 ULV Intel® Celeron® 3.5” SBC w/400 MHz CPU, VGA/LCD, LVDS, Ethernet, Audio, IFM32MB, WinCE5.0 Image ( Free NRE Charge) WAFER-9371A-WINXPE ULV Intel® Celeron® 3.5” SBC w/400 MHz CPU, VGA/LCD, LVDS, Ethernet, Audio, IFM512MB, WinXPE Image ( Free NRE Charge) Packing List 1 x Wafer-9371A 1 x Parallel port cable 1 x Mini Jumper Pack 1 x Audio cable 1 x IDE flat cable 44p/40p/40p 1 x USB cable 1 x Keyboard/ PS2 mouse cable 1 x User manual 1 x Second serial port cable 1 x Utility CD LPT cable P/N: 32200-015100-RS Option JY eSolution Innovator eSolution Innovator